This introductory session establishes the company’s core identity and its unique approach to the semiconductor market. It explores a product philosophy built on the pillars of extreme scalability, open architecture, and vertical integration to reduce Total Cost of Ownership (TCO). By the end of this section, the audience will understand how the company’s commitment to agility and simplicity drives its engineering decisions. Xsight Labs, a fabless semiconductor company founded in 2017, designs and sells chips manufactured through TSMC. Led by serial entrepreneurs and backed by $440 million in top-tier VC funding, the company employs over 200 engineers globally. Their unique approach aims to democratize the semiconductor space by providing open, programmable, and vertically integrated solutions for the rapidly evolving AI and data center infrastructure markets.

Xsight Labs focuses on two critical components of the "AI factory" or "token machine": an Ethernet switch chip (X-series) and a Data Processing Unit (DPU) or infrastructure processor (E-series). These products are developed on 5nm technology, are generally available, and the X-series is already in mass production. The company emphasizes a "software-defined infrastructure" philosophy, claiming to be the first chip company to offer wire-speed, energy-efficient, and truly programmable products without compromising performance, price, or power. This agility is crucial given the unpredictable nature of future AI applications, and their open instruction sets and collateral allow for community contributions and custom compilers, accelerating innovation.

The E-series DPU, specifically the E1 800 gig product, is designed from an ARM server perspective rather than a traditional network interface card, offering 64-core ARM chips with derivatives to optimize for various power and performance needs. The upcoming E1L will be a low-power version targeting control plane markets and programmable SmartNICs. The X-series Ethernet switch, with its X2 12.8 terabit monolithic die, stands out for its exceptionally low power consumption (180W compared to competitors' 300-600W) while maintaining high performance, low latency, and full programmability from Layer 1 to Layer 4 with embedded memory switches. The future X3 will further expand bandwidth and radix points through clever die combining, reinforcing Xsight Labs' commitment to innovative, power-efficient, and highly flexible infrastructure solutions.

Presented by Ted Weatherford, Vice President of Business Development, Xsight Labs. Recorded live at AI Infrastructure Field Day in Santa Clara on January 29th, 2026. Watch the entire presentation at https://techfieldday.com/appearance/xsight-labs-presents-at-ai-infrastructure-field-day/ or visit https://techfieldday.com/event/aiifd4/ or https://xsightlabs.com/ for more information.