A Leap Forward in Storage Efficiency with the OFP Initiative and Hammerspace
AI Infrastructure Field Day 4
•
11m
Hammerspace is driving the Open Flash Platform (OFP) Initiative, an effort to significantly reduce the complexity and cost associated with large-scale flash storage for AI and other demanding workloads. This presentation introduced a reference design for a high-density, low-power flash storage solution that achieves unprecedented capacity and efficiency within data centers. The goal is to deliver one exabyte of storage in a single rack, enabling a new paradigm of "disappearing storage" in which compact 1U systems are distributed throughout a data center, leveraging otherwise unused rack space and minimal power consumption.
The development process involved several design iterations, shifting from a challenging 2U form factor to a more efficient 1U design. This shift addressed issues such as chassis deformation, power/cooling inefficiencies, and wasted space, requiring extensive thermal and pressure analyses to ensure reliable operation in a tightly packed environment. A significant breakthrough was selecting the Xsight DPU, which delivers robust compute capabilities comparable to an x86 server from a few years ago, in a highly power-efficient package that supports Linux and storage services within this compact design. Ted Weatherford highlighted the Xsight E1 chip as the world's first 800-Gig DPU, featuring 64 Neoverse cores, a programmable NIC, and an "all fast path design" that eliminates data bottlenecks, achieving 800-Gig line rates, as independently verified by KeySite.
Looking ahead, Hammerspace and its partners are actively exploring new flash form factors to overcome current E2 limitations and achieve the one exabyte-per-rack goal. The OFP Initiative aims to standardize within the Open Compute Project (OCP) to ensure broad industry adoption and benefits. The versatility of the Xsight chip enables applications beyond shared file storage, including block storage and a homogeneous boot device for hyperscalers, streamlining qualification and management across diverse server infrastructures. The project is currently in prototyping and validation, with early-access customers receiving units this quarter and general availability targeted for the second half of the year, while continually recruiting more industry participants to drive this standard forward.
Presented by Kurt Kuckein, Sr. Director AI Product Marketing, Hammerspace, and Ted Weatherford, Vice President of Business Development, Xsight Labs. Recorded live at AI Infrastructure Field Day in Santa Clara on January 29th, 2026. Watch the entire presentation at https://techfieldday.com/appearance/hammerspace-presents-at-ai-infrastructure-field-da/ or visit https://techfieldday.com/event/aiifd4/ or https://hammerspace.com/ for more information.
Up Next in AI Infrastructure Field Day 4
-
Redefining Infrastructure Philosophy ...
This introductory session establishes the company’s core identity and its unique approach to the semiconductor market. It explores a product philosophy built on the pillars of extreme scalability, open architecture, and vertical integration to reduce Total Cost of Ownership (TCO). By the end of t...
-
The X Series Architecting for High Pe...
This section provides a high-level overview of the product roadmap, specifically introducing the X-Series and E-Series lineups. It identifies the six critical chips required to build modern AI Factories and explains the concept of a “Truly Software Defined” stack that operates at full line-rate a...
-
The E-Series Delivering Cloud-on-a-Ch...
The E-Series session explores the convergence of storage, networking, compute, and security into a single, cohesive silicon platform. This “Cloud-on-a-chip” approach is dissected through its architecture and programming model to show how it simplifies complex data center environments. We will hig...